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Product introduction: Sapphire wafer is a kind of single crystal with hexagonal structure manufactured by Al2 O3 of high purity. It has the advantages of corrosion resistance, high temperature and pressure resistance, low dielectric loss and high heat stability. It is the ideal material for Light Emitting Diode and lasing diode.
Application: PSS substrate, epitaxial substrate.
| 蓝宝石晶片/Sapphire Wafer |
| |||
| 项目/Item | 2英寸/2 Inch | 4英寸/4 Inch | 6英寸/6 Inch |
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| 晶体/Crystal | LED Grade Sapphire | LED Grade Sapphire | LED Grade Sapphire |
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| 蓝宝石纯度/ | ≥99.998% | ≥99.998% | ≥99.998% |
|
| Sapphire purity |
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| 颜色/Color | 无色透明/ | 无色透明/ | 无色透明/ |
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| Transparent | Transparent | Transparent |
| |
| 方向/Orientation | C面偏M轴0.20°±0.1°角度/ | C偏M轴0.20°±0.1°角度/ | C偏M轴0.20°±0.1°角度/ |
|
| C plane tiled M axis 0.20°±0.1° | C plane tiled M axis 0.20°±0.1° | C plane tiled M axis 0.20°±0.1° |
| |
| 直径/Diameter | 50.8±0.1mm | 100±0.2mm | 150±0.2mm |
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| 厚度/Thickness | 430±15μm | 650±25μm | 1300±25μm |
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| 定位面方向/Primary Flat Location | A-axis ± 0.2° | A-axis ± 0.2° | A-axis ± 0.2° |
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| 定位面长度/Flat Length | 16.0±1.0 mm | 30.0 ±1.0 mm | 49.0±1.0 mm |
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| 抛光面Front Side Surface | Mirror polished , EPI-Ready | Mirror polished , EPI-Ready | Mirror polished , EPI-Ready |
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| 表面粗超度/Surface Roughness | Ra < 3Å | Ra < 3Å | Ra < 3Å |
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| 背面粗超度/Back Side Roughness | Fine ground, Ra=1.0±0.2um | Fine ground, Ra=1.0±0.2um | Fine ground, Ra=1.0±0.2um |
|
| 平坦度/TTV | ≤ 5.0μm | ≤ 10μm | ≤ 15μm |
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| 中心弯曲度/BOW | 0～-5um | 0～-10um | 0～-30um |
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| 整体弯曲度/Warp | ≤ 10.0μm | ≤15μm | ≤ 40μm |
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| 气泡和颜色/Bubble & Color | None by visual inspection in intensive light | None by visual inspection in intensive light | None by visual inspection in intensive light |
|
| 表面边界/Ground Boundary | None by visual inspection in fluorescent light | None by visual inspection in fluorescent light | None by visual inspection in fluorescent light |
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| 清洁度/Cleanliness | Free visible contamination | Free visible contamination | Free visible contamination |
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| 包装/Packaging | Vacuum packed in one-piece box or Entegris cassettes of 25 | Vacuum packed in one-piece box or Entegris cassettes of 25 | Vacuum packed in one-piece box or Entegris cassettes of 25 |
|
| in a class 100 clean room, under a nitrogen atmosphere | in a class 100 clean room, under a nitrogen atmosphere | in a class 100 clean room, under a nitrogen atmosphere |
| |
Product introduction: Sapphire wafer is a kind of single crystal with hexagonal structure manufactured by Al2 O3 of high purity. It has the advantages of corrosion resistance, high temperature and pressure resistance, low dielectric loss and high heat stability. It is the ideal material for Light Emitting Diode and lasing diode.
Application: PSS substrate, epitaxial substrate.
| 蓝宝石晶片/Sapphire Wafer |
| |||
| 项目/Item | 2英寸/2 Inch | 4英寸/4 Inch | 6英寸/6 Inch |
|
| 晶体/Crystal | LED Grade Sapphire | LED Grade Sapphire | LED Grade Sapphire |
|
| 蓝宝石纯度/ | ≥99.998% | ≥99.998% | ≥99.998% |
|
| Sapphire purity |
| |||
| 颜色/Color | 无色透明/ | 无色透明/ | 无色透明/ |
|
| Transparent | Transparent | Transparent |
| |
| 方向/Orientation | C面偏M轴0.20°±0.1°角度/ | C偏M轴0.20°±0.1°角度/ | C偏M轴0.20°±0.1°角度/ |
|
| C plane tiled M axis 0.20°±0.1° | C plane tiled M axis 0.20°±0.1° | C plane tiled M axis 0.20°±0.1° |
| |
| 直径/Diameter | 50.8±0.1mm | 100±0.2mm | 150±0.2mm |
|
| 厚度/Thickness | 430±15μm | 650±25μm | 1300±25μm |
|
| 定位面方向/Primary Flat Location | A-axis ± 0.2° | A-axis ± 0.2° | A-axis ± 0.2° |
|
| 定位面长度/Flat Length | 16.0±1.0 mm | 30.0 ±1.0 mm | 49.0±1.0 mm |
|
| 抛光面Front Side Surface | Mirror polished , EPI-Ready | Mirror polished , EPI-Ready | Mirror polished , EPI-Ready |
|
|
| ||||
| 表面粗超度/Surface Roughness | Ra < 3Å | Ra < 3Å | Ra < 3Å |
|
| 背面粗超度/Back Side Roughness | Fine ground, Ra=1.0±0.2um | Fine ground, Ra=1.0±0.2um | Fine ground, Ra=1.0±0.2um |
|
| 平坦度/TTV | ≤ 5.0μm | ≤ 10μm | ≤ 15μm |
|
| 中心弯曲度/BOW | 0～-5um | 0～-10um | 0～-30um |
|
| 整体弯曲度/Warp | ≤ 10.0μm | ≤15μm | ≤ 40μm |
|
| 气泡和颜色/Bubble & Color | None by visual inspection in intensive light | None by visual inspection in intensive light | None by visual inspection in intensive light |
|
| 表面边界/Ground Boundary | None by visual inspection in fluorescent light | None by visual inspection in fluorescent light | None by visual inspection in fluorescent light |
|
| 清洁度/Cleanliness | Free visible contamination | Free visible contamination | Free visible contamination |
|
| 包装/Packaging | Vacuum packed in one-piece box or Entegris cassettes of 25 | Vacuum packed in one-piece box or Entegris cassettes of 25 | Vacuum packed in one-piece box or Entegris cassettes of 25 |
|
| in a class 100 clean room, under a nitrogen atmosphere | in a class 100 clean room, under a nitrogen atmosphere | in a class 100 clean room, under a nitrogen atmosphere |
| |
